Built-in Self Repair for Logic StructuresTobias Koal (Brandenburg University of Technology Cottbus, Germany) and Heinrich Theodor Vierhaus (Brandenburg University of Technology Cottbus, Germany)
Copyright © 2011. 25 pages.
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DOI: 10.4018/978-1-60960-212-3.ch010, ISBN13: 9781609602123, ISBN10: 1609602129, EISBN13: 9781609602147 Sample PDFCite Chapter
MLA
Koal, Tobias and Heinrich Theodor Vierhaus. "Built-in Self Repair for Logic Structures." Design and Test Technology for Dependable Systems-on-Chip. IGI Global, 2011. 216-240. Web. 23 May. 2012. doi:10.4018/978-1-60960-212-3.ch010
APA
Koal, T., & Vierhaus, H. T. (2011). Built-in Self Repair for Logic Structures. In R. Ubar, J. Raik, & H. Vierhaus (Eds.), Design and Test Technology for Dependable Systems-on-Chip (pp. 216-240). Hershey, PA: Information Science Reference. doi:10.4018/978-1-60960-212-3.ch010
Chicago
Koal, Tobias and Heinrich Theodor Vierhaus. "Built-in Self Repair for Logic Structures." In Design and Test Technology for Dependable Systems-on-Chip, ed. Raimund Ubar, Jaan Raik and Heinrich Theodor Vierhaus, 216-240 (2011), accessed May 23, 2012. doi:10.4018/978-1-60960-212-3.ch010
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 Favorite | | TopAbstractFor several years, many authors have predicted that nano-scale integrated devices and circuits will have a rising sensitivity to both transient and permanent faults effects. Essentially, there seems to be an emerging demand for building highly dependable hardware / software systems from unreliable components. Most of the effort has so far gone into the detection and compensation of transient fault effects. More recently, also the possibility of repairing permanent faults, due to either production flaws or to wear-out effects after some time of operation in the field of application, needs further investigation. While built-in self test (BIST) and even self repair (BISR) for regular structures such as static memories (SRAMs) is well understood, concepts for in-system repair of irregular logic and interconnects are few and mainly based on field-programmable gate-arrays (FPGAs) as the basic implementation. In this chapter, the authors try to analyse different schemes of logic (self-) repair with respect to cost and limitations, using repair schemes that are not based on FPGAs. It can be shown that such schemes are feasible, but need lot of attention in terms of hidden single points of failure. TopComplete Chapter List|
1.
| System-Level Design of NoC-Based Dependable Embedded Systems
(pages 1-36)
Mihkel Tagel (Tallinn University of Technology, Estonia), Peeter Ellervee (Tallinn University of Technology, Estonia), Gert Jervan (Tallinn University of Technology, Estonia)
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2.
| Synthesis of Flexible Fault-Tolerant Schedules for Embedded Systems with Soft and Hard Timing Constraints
(pages 37-65)
Viacheslav Izosimov (Semcon AB, Sweden), Paul Pop (Technical University of Denmark, Denmark), Petru Eles (Linköping University, Sweden), Zebo Peng (Linköping University, Sweden)
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3.
| Optimizing Fault Tolerance for Multi-Processor System-on-Chip
(pages 66-91)
Dimitar Nikolov (Linköping University, Sweden), Mikael Väyrynen (Linköping University, Sweden), Urban Ingelsson (Linköping University, Sweden), Virendra Singh (Indian Institute of Science, India), Erik Larsson (Linköping University, Sweden)
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4.
| Diagnostic Modeling of Digital Systems with Multi-Level Decision Diagrams
(pages 92-118)
Raimund Ubar (Tallinn University of Technology, Estonia), Jaan Raik (Tallinn University of Technology, Estonia), Artur Jutman (Tallinn University of Technology, Estonia), Maksim Jenihhin (Tallinn University of Technology, Estonia)
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5.
| Enhanced Formal Verification Flow for Circuits Integrating Debugging and Coverage Analysis
(pages 119-131)
Daniel Große (University of Bremen, Germany), Görschwin Fey (University of Bremen, Germany), Rolf Drechsler (University of Bremen, Germany)
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6.
| Advanced Technologies for Transient Faults Detection and Compensation
(pages 132-154)
Matteo Sonza Reorda (Politecnico di Torino, Italy), Luca Sterpone (Politecnico di Torino, Italy), Massimo Violante (Politecnico di Torino, Italy)
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7.
| Memory Testing and Self-Repair
(pages 155-174)
Mária Fischerová (Institute of Informatics of the Slovak Academy of Sciences, Slovakia), Elena Gramatová (Institute of Informatics of the Slovak Academy of Sciences, Slovakia)
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8.
| Fault-Tolerant and Fail-Safe Design Based on Reconfiguration
(pages 175-194)
Hana Kubatova (Czech Technical University in Prague, Czech Republic), Pavel Kubalik (Czech Technical University in Prague, Czech Republic)
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9.
| Self-Repair Technology for Global Interconnects on SoCs
(pages 195-215)
Daniel Scheit (Brandenburg University of Technology Cottbus, Germany), Heinrich Theodor Vierhaus (Brandenburg University of Technology Cottbus, Germany)
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10.
| Built-in Self Repair for Logic Structures
(pages 216-240)
Tobias Koal (Brandenburg University of Technology Cottbus, Germany), Heinrich Theodor Vierhaus (Brandenburg University of Technology Cottbus, Germany)
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11.
| Self-Repair by Program Reconfiguration in VLIW Processor Architectures
(pages 241-267)
Mario Schölzel (Brandenburg University of Technology Cottbus, Germany), Pawel Pawlowski (Poznan University of Technology, Poland), Adam Dabrowski (Poznan University of Technology, Poland)
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12.
| Fault Simulation and Fault Injection Technology Based on SystemC
(pages 268-293)
Silvio Misera (Kjellberg Finsterwalde, Germany), Roberto Urban (Brandenburg University of Technology Cottbus, Germany)
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13.
| High-Level Decision Diagram Simulation for Diagnosis and Soft-Error Analysis
(pages 294-309)
Jaan Raik (Tallinn University of Technology, Estonia), Urmas Repinski (Tallinn University of Technology, Estonia), Maksim Jenihhin (Tallinn University of Technology, Estonia), Anton Chepurov (Tallinn University of Technology, Estonia)
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14.
| High-Speed Logic Level Fault Simulation
(pages 310-337)
Raimund Ubar (Tallinn University of Technology, Estonia), Sergei Devadze (Tallinn University of Technology, Estonia)
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15.
| Software-Based Self-Test of Embedded Microprocessors
(pages 338-359)
Paolo Bernardi (Politecnico di Torino, Italy), Michelangelo Grosso (Politecnico di Torino, Italy), Ernesto Sánchez (Politecnico di Torino, Italy), Matteo Sonza Reorda (Politecnico di Torino, Italy)
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16.
| SoC Self Test Based on a Test-Processor
(pages 360-376)
Tobial Koal (Brandenburg University of Technology Cottbus, Germany), Rene Kothe (Brandenburg University of Technology Cottbus, Germany), Heinrich Theodor Vierhaus (Brandenburg University of Technology Cottbus, Germany)
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17.
| Delay Faults Testing
(pages 377-394)
Marcel Baláž (Institute of Informatics of the Slovak Academy of Sciences, Slovakia), Roland Dobai (Institute of Informatics of the Slovak Academy of Sciences, Slovakia), Elena Gramatová (Institute of Informatics of the Slovak Academy of Sciences, Slovakia)
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18.
| Low Power Testing
(pages 395-412)
Zdenek Kotásek (Brno University of Technology, Czech Republic), Jaroslav Škarvada (Brno University of Technology, Czech Republic)
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19.
| Thermal-Aware SoC Test Scheduling
(pages 413-433)
Zhiyuan He (Linköping University, Sweden), Zebo Peng (Linköping University, Sweden), Petru Eles (Linköping University, Sweden)
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20.
| Study on Combined Test-Data Compression and Test Planning for Testing of Modular SoCs
(pages 434-459)
Anders Larsson (Linköping University, Sweden), Urban Ingelsson (Linköping University, Sweden), Erik Larsson (Linköping University, Sweden), Krishnendu Chakrabarty (Duke University, USA)
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21.
| Reduction of the Transferred Test Data Amount
(pages 460-475)
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22.
| Sequential Test Set Compaction in LFSR Reseeding
(pages 476-493)
Artur Jutman (Tallinn University of Technology, Estonia), Igor Aleksejev (Tallinn University of Technology, Estonia), Jaan Raik (Tallinn University of Technology, Estonia)
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