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However, the semiconductor industry is mature today, it also push forward the orders increasing in the Wafer Probing, IC Packaging and Testing industries. In order to satisfy customer requirements, companies adopted multi-plant production type from single-plant production type and achieved the minimizing of the total cost by sharing the capacity resource. In the IC packaging process, including operations of die sawing, die bonding, wire bonding, molding, plating, marking, trim/form, and inspection. Purposes of packaging include protecting ICs, making ICs easier to handle, and connecting ICs to the circuit outside. The definition of production time to whole IC packaging factory is composed of three parts (see Fig.1). They are Setup time, Operation time, and Non-operation time (M.P. Grover, 2001.).
Figure 1. The composition chart diagram of production time
By the definition of production time, the “revising machine operation procedure” will directly affect the setup time and non-operation time, in addition, also affect the production time.