Design of New Reconfigurable and Miniature Microstrip Planar Antennas

Design of New Reconfigurable and Miniature Microstrip Planar Antennas

Ridouane Er-Rebyiy (University of Hassan 1st, Morocco), Jamal Zbitou (University of Hassan 1st, Morocco), Abdelali Tajmouati (University of Hassan 1st, Morocco), and Mohamed Latrach (Microwave Group, ESEO, France)
Copyright: © 2019 |Pages: 35
DOI: 10.4018/978-1-5225-7539-9.ch007
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Recently, wireless communication systems have developed rapidly and have become more mobile and small. This necessarily requires the adequacy of its design. The materials used should be as much as possible small and at a lower cost. So low cost with reduced volume and low weight are some of the major challenges that must be faced by the designer of modern telecommunications equipment. The microstrip planar antenna is an attraction and the most crucial component used in mobile systems, and its miniaturization is one of the research challenges. This chapter focuses on the concept of miniature reconfigurable antennas by presenting and discussing the state of art with contributions in designing reconfigurable miniature printed antennas.
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Microstrip Patch Antennas


In its most basic form, a microstrip patch antenna consists of a radiator mounted on an FR4 substrate associated to a ground plane as shown in Figure 1 (Carver, 1981).

Figure 1.

Structure of a Microstrip Patch Antenna


The different parameters of the antenna are as follows: L is the length of the patch, w is the width; h is the thickness of substrate and t is the metallization thickness of the patch.

The patch is generally square, rectangular, circular, triangular, and elliptical or other shapes as illustrated in Figure 2. Square, rectangular, and circular are the most celebrated because of ease of analysis, fabrication, and their attractive radiation characteristics, especially low cross-polarization radiation (Bahl, 1980; Wheeler, 1959; Abla, 2010).

Figure 2.

Representative Shapes of microstrip patch elements. (Bahl, 1980)


Key Terms in this Chapter

FET: Field effect transistor.

ISM: Industrial, scientific, medical.

CAO: Conception assistée par ordinateur.

WiMAX: Worldwide interoperability for microwave access.

RC: Radio cognitive.

GSM: Global system of mobile communication.

CST: Computer simulation technology.

EM: Electromagnetic.

SDR: Software-defined radio.

MIC: Microwave-integrated circuit.

AEP: Antenne électriquement petite.

MPA: Microstrip patch antenna.

ADS: Advanced design software.

TR: Tuning range.

TM: Transverse magnetic.

MIMO: Multiple-input multiple-output.

RFID: Radio frequency identification.

RMPA: Rectangular microstrip patch antenna.

FDTD: Finite difference in time domain.

RF: Radio frequency.

TEM: Transverse electromagnetic.

Wi-Fi: Wireless fidelity.

GPS: Global positioning system.

SISO: Single-input single-output.

TS: Total spectrum.

WLAN: Wireless local area network.

VNA: Vector network analyzer.

J: Densité du courant électrique, [A/m2].

M: Densité d’un flux de magnétique, [V/m2].

DCS: Digital communication system.

LTE: Long-term evolution.

DGS: Defected ground structure.

TE: Transverse electric.

SRR: Complementary split ring resonators.

MTM: Métamatériaux.

IEEE: Institute of Electrical and Electronics Engineers.

WPAN: Wireless personal area network.

Fit: Finite integration technique.

PIN: Positive intrinsic negative.

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