Evaluation of Surface Roughness in Wire Electrical Discharge Turning Process

Evaluation of Surface Roughness in Wire Electrical Discharge Turning Process

Sibabrata Mondal (Society for Applied Microwave Electronics Engineering and Research (SAMEER), Kolkata, India) and Dipankar Bose (National Institute of Technical Teachers' Training and Research (NITTTR), Kolkata, India)
DOI: 10.4018/978-1-7998-3624-7.ch008
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Abstract

This investigation presents an experimental investigation in developing small cylindrical pins in electrolytic tough pitch copper (ETP Cu) material using wire electrical discharge turning (WEDT) to evaluate surface roughness of the cylindrical turning faces. The material ETP Cu is soft in nature and has growing range of application in the field of aerospace and electronics industries for advanced applications. In this process, a customized rotary spindle has been developed and added to five-axis CNC wire electrical discharge machine (WEDM) and straight turning of the cylindrical pin has been done up to a length of 15mm with 0.5mm diameter. Under this investigation, 31 experiments along with two confirmation tests have been carried out to study the influence of four design factors—pulse on time, pulse off time, spindle speed, and servo voltage—on the machining performance of surface roughness by means the technique of design of experiment (DOE).
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Introduction

In 1974, D.H. Dulebohn utilized the optical-line follower system which controls the shape of the component automatically by WEDM process (Qu et al., 2002). In 1975, the process and its capabilities were better understood by the industry. As a result, they have started to utilize this process rapidly. Actually, the end of 1970s, when computer numeric control (CNC) system was introduced into WEDM process, from that time onward a major evolution happened in the manufacturing process (Scott et al. 2004). The common applications of WEDM include the fabrication of dies, stamping and extrusion tools, fixtures and gauges and medical parts, prototypes etc.

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