MLA
Bedi, Harkeerat, and Li Yang. "A Resilient Fair Electronic Contract Signing Protocol." Security and Privacy Assurance in Advancing Technologies: New Developments, edited by Hamid Nemati, IGI Global, 2011, pp. 271-294. https://doi.org/10.4018/978-1-60960-200-0.ch017
APA
Bedi, H. & Yang, L. (2011). A Resilient Fair Electronic Contract Signing Protocol. In H. Nemati (Ed.), Security and Privacy Assurance in Advancing Technologies: New Developments (pp. 271-294). IGI Global. https://doi.org/10.4018/978-1-60960-200-0.ch017
Chicago
Bedi, Harkeerat, and Li Yang. "A Resilient Fair Electronic Contract Signing Protocol." In Security and Privacy Assurance in Advancing Technologies: New Developments, edited by Hamid Nemati, 271-294. Hershey, PA: IGI Global, 2011. https://doi.org/10.4018/978-1-60960-200-0.ch017
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