What is Heat Pipe

Through the ongoing downsizing and fast growth of heat flow of electronic components, cooling concerns are confronting severe tasks. This chapter examines the recent advancements and modernization in the cooling of electronics. The most popular electronic cooling technologies, which are classed as direct and indirect cooling, are examined and described in depth. The best prevalent methods of indirect cooling by employing heat pipes, microchannels, PCM are discussed. The efficiency of cooling strategies for various levels of electronic cooling requirements, as well as approaches to increase heat transfer capabilities, are also discussed in depth. Meanwhile, by considering the intrinsic thermal characteristics, optimization approaches, and pertinent uses, the advantages and disadvantages of various thermal management systems are examined. Furthermore, the present issues of electronic cooling and thermal management technologies are discussed as well as the prospects for future advancements.