A heat pump transfers heat energy from one location to another. They are frequently used to transmit thermal energy by collecting heat from a cold environment and transferring it to a warmer environment.
Published in Chapter:
Electronic Cooling
Shankara Murthy H. M. (Sahyadri College of Engineering and Management, India), Niranjana Rai (Canara Engineering College, India), and Ramakrishna N. Hegde (Srinivas Institute of Technology, India)
Copyright: © 2023
|Pages: 23
DOI: 10.4018/978-1-6684-4974-5.ch006
Abstract
Through the ongoing downsizing and fast growth of heat flow of electronic components, cooling concerns are confronting severe tasks. This chapter examines the recent advancements and modernization in the cooling of electronics. The most popular electronic cooling technologies, which are classed as direct and indirect cooling, are examined and described in depth. The best prevalent methods of indirect cooling by employing heat pipes, microchannels, PCM are discussed. The efficiency of cooling strategies for various levels of electronic cooling requirements, as well as approaches to increase heat transfer capabilities, are also discussed in depth. Meanwhile, by considering the intrinsic thermal characteristics, optimization approaches, and pertinent uses, the advantages and disadvantages of various thermal management systems are examined. Furthermore, the present issues of electronic cooling and thermal management technologies are discussed as well as the prospects for future advancements.