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Performance Analysis of Mixed-Wall CNT Interconnects Using Colliding Bodies Optimization Technique

Performance Analysis of Mixed-Wall CNT Interconnects Using Colliding Bodies Optimization Technique

Girish Kumar Mekala, Yash Agrawal, Rajeevan Chandel, Ashwani Kumar
Copyright: © 2020 |Pages: 23
ISBN13: 9781799813934|ISBN10: 1799813932|ISBN13 Softcover: 9781799813941|EISBN13: 9781799813958
DOI: 10.4018/978-1-7998-1393-4.ch009
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MLA

Mekala, Girish Kumar, et al. "Performance Analysis of Mixed-Wall CNT Interconnects Using Colliding Bodies Optimization Technique." Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET), edited by Balwinder Raj, et al., IGI Global, 2020, pp. 189-211. https://doi.org/10.4018/978-1-7998-1393-4.ch009

APA

Mekala, G. K., Agrawal, Y., Chandel, R., & Kumar, A. (2020). Performance Analysis of Mixed-Wall CNT Interconnects Using Colliding Bodies Optimization Technique. In B. Raj, M. Khosla, & A. Singh (Eds.), Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET) (pp. 189-211). IGI Global. https://doi.org/10.4018/978-1-7998-1393-4.ch009

Chicago

Mekala, Girish Kumar, et al. "Performance Analysis of Mixed-Wall CNT Interconnects Using Colliding Bodies Optimization Technique." In Major Applications of Carbon Nanotube Field-Effect Transistors (CNTFET), edited by Balwinder Raj, Mamta Khosla, and Amandeep Singh, 189-211. Hershey, PA: IGI Global, 2020. https://doi.org/10.4018/978-1-7998-1393-4.ch009

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Abstract

In recent years, carbon nanotube (CNT) interconnects have emerged as a potential alternative to copper interconnects due to their several magnificent properties. Due to fabrication issues, realization of densely packed CNTs with uniform diameters in a bundle structure is difficult to achieve. Consequently, it is advantageous to obtain a combination of CNTs with non-uniform diameters in the bundle, thereby leading to a densely packed mixed-wall CNT bundle (MWCB). In a MWCB structure, tube density plays a major role to determine the parasitic elements associated with the interconnects. For this, prospectively, colliding bodies optimization (CBO) technique has been incorporated. It is inferred from the study that the overall crosstalk noise, delay, and power dissipation of MWCB interconnect with higher tube density (i.e., obtained using CBO technique) are lesser than other CNT structures. Henceforth, it is determined from the proposed work that prospective CBO technique for advanced MWCB structure is highly efficient and effective for on-chip interconnects in IC designs.

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