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International Journal of Biomaterials Research and Engineering (IJBRE)

International Journal of Biomaterials Research and Engineering (IJBRE)

Indexed by Inspec (more)
Editor-in-Chief: Keshav Deo Verma (S.V. (P.G.) College, India)
Indexed In: INSPEC and 11 more indices
Published: Semi-Annually |Established: 2011
ISSN: 1947-3575|EISSN: 1947-3583|DOI: 10.4018/IJBRE
Out of print.
Description & Scope
Description:
The International Journal of Biomaterials Research and Engineering (IJBRE) covers all aspects of scientific and technological advancements in the fields of biomaterials; medical, biological, and nanoscale sciences; and bio-inspired computing. The journal integrates the latest advancements in... Show More
Mission & Scope:
The mission of the International Journal of Biomaterials Research and Engineering (IJBRE) is to disseminate the latest research in biomaterials and their application in the fields of engineering and science, as well as developments in medicine, biology, chemistry, DNA computing, artificial organs, materials science, nano science, and technology. The goal of the journal is to provide a platform... Show More
Coverage:
  • Advanced functional materials
  • Artificial organs and tissues
  • Bioengineering Materials
  • Bio-inspired computation techniques
  • Biological materials
  • Biological response to nanomaterials
  • Biomaterial characterization
  • Biomaterial synthesis
  • Biomaterials and bioinformatics
  • Biomaterials and biometric computer security
  • Biomaterials and biometric information security
  • Biomaterials and biometric security
  • Biomaterials and biosensors
  • Biomaterials and cardiovascular devices
  • Biomaterials and computer applications
  • Biomaterials and soft computing
  • Biomaterials at the nano level
  • Bio-nanomaterials and nanotechnology
  • Computational biomaterials
  • DNA Computing
  • Medical Devices
  • Microscopy and materials characterization techniques
  • Modeling of behavior of biomaterials
  • Nano biomaterials
  • Nano biosensors
  • Nano computing
  • Nano thin films
  • Nanomaterials for biomedical applications
  • Novel applications of biomaterials
  • Novel materials and their application
  • Processes for biomaterials synthesis
  • Tissue Engineering
  • Use of biomaterials in biometrics
  • Use of biomaterials in engineering research
Editorial Board

Editorial Board

Associate Editors
Larry Bonassar, Cornell University, USA
Wang Dongan, Nanyang Technological University, Singapore
A. Jayakrishnan, University of Kerala, India
Ding Jun, National University of Singapore, Singapore
Sang Yup Lee, Korea Advanced Institute of Science and Technology, Korea
Feng-Huei Lin, National Taiwan University, Taiwan
L.A. Poole-Warren, University of New South Wales, Australia
Suzie Hwang Pun, University of Washington, USA
Maryam Tabrizian, McGill University, USA
Andrew Wan, Institute of Bioengineering and Nanotechnology, Singapore
Junji Watanabe, Osaka University, Japan
Zhilian Yue, Intelligent Polymer Research Institute, University of Wollongong, Australia
Hala Zreiqat, The University of Sydney, Australia

International Editorial Review Board
Tanyarut Boontheekul, Thailand
Hak Soo Choi, Harvard Medical School, USA
Xiaodong Li, University of South Carolina, USA
Leo Hwa Liang, National University of Singapore, Singapore
Joachim Loo, Nanyang Technological University, Singapore
Khan Majad, Institute of Bioengineering and Nanotechnology, Singapore
Gopinath Mani, University of Texas at San Antonio, USA
Jeremy Teo Choon Meng, Institute of Bioengineering and Nanotechnology, Singapore
Tamil Selvan Subramanian, Institute of Materials Research & Engineering, Singapore
Xuejun Wen, Medical University of South Carolina, USA
Jian Yang, The University of Texas at Arlington, USA
Editorial Policy
IGI Global holds its journals to the highest ethical practices. View Full Editorial Policy
Latest Articles

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  • Standard (Non-OA) Publishing: If the author chooses to publish under the Standard (Non-OA) model, the article will be published under a Green OA model and the copyright of their article will transfer to IGI Global under our Author Warranty and Transfer of Copyright Agreement. However, through Green OA, IGI Global supports a Fair Use Policy, enabling authors to Post the final typeset PDF (which includes the title page, table of contents and other front materials, and the copyright statement) of their chapter or article (NOT THE ENTIRE BOOK OR JOURNAL ISSUE), on the author or editor's secure personal website and/or their university repository site. See the Fair Use Policy for sharing allowances conducive to Green Open Access.
  • Open Access Publishing: If the author choses to publish under OA, the authors receive the Creative Commons Attribution 4.0 International (CC BY 4.0) licensing arrangement. The copyright for the work remains solely with the author(s) of the article. Others may distribute, remix, tweak, and build upon the work, even commercially, without asking prior permission from the publisher or author and so long as they credit the author for the original creation. All authors are required to sign an author's warranty stating that the materials are original and unpublished elsewhere. The journal will not publish any material that has been previously published elsewhere. Learn More

Article Processing Charges
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Open Access Publishing: Article manuscripts receive the Creative Commons Attribution 4.0 International (CC BY 4.0) licensing arrangement. The copyright for the work remains solely with the author(s) of the article. Others may distribute, remix, tweak, and build upon the work, even commercially, without asking prior permission from the publisher or author and so long as they credit the author for the original creation. A one-time Article Processing Charge (APC) of US $2,300 must be paid AFTER the manuscript has gone through the full double-blind peer review process and the Editor(s)-in-Chief at his/her/their full discretion has decided to accept the manuscript based on the results of the double-blind peer review process. Learn more about APCs here.
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Contact
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Hershey, PA 17033, USA
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