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International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME)
Emerging Sources Citation Index

International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME)

Editor-in-Chief: J. Paulo Davim (University of Aveiro, Portugal)
Indexed In: Web of Science Emerging Sources Citation Index (ESCI), SCOPUS, INSPEC and 15 more indices
Published: Quarterly |Established: 2011
ISSN: 2156-1680|EISSN: 2156-1672|DOI: 10.4018/IJMMME
Institution Prices for Volume 12 (2022)
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  • Free shipping on orders $395+
  • Printed-On-Demand (POD)
  • Multi-user license (no added fee)
  • Immediate access after purchase
  • No DRM
  • ePub with PDF download
  • 20% discount on 5+ titles*
Individual Prices for Volume 12 (2022)
Print Journal:
$315.00
TOTAL SAVINGS: $315.00
Benefits
  • Free shipping on orders $395+
  • Printed-On-Demand (POD)
  • 20% discount on 5+ titles*
E-Journal:
$315.00
TOTAL SAVINGS: $315.00
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  • Immediate access after purchase
  • No DRM
  • ePub with PDF download
  • 20% discount on 5+ titles*
Print +
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  • Immediate access after purchase
  • No DRM
  • ePub with PDF download
  • 20% discount on 5+ titles*
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Description & Scope
Description:
The International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) is a refereed, interdisciplinary journal that publishes high quality articles with special emphasis on research and development in manufacturing, materials and mechanical engineering. IJMMME provides... Show More
Mission & Scope:
The mission of the International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) is to provide a channel of communication to disseminate knowledge between academics/researchers and industry practitioners. This journal can serve as a useful reference for academics, manufacturing, materials, mechanical, industrial, systems, environmental and physics engineers, materials... Show More
Coverage:
  • Aerodynamics and fluid mechanics
  • Artificial intelligence applied, optimization methods
  • Automation and control
  • Bioengineering materials, biomechanics and biotribology
  • Bulk deformation processes and sheet metal forming
  • Composites, ceramics, polymers / processing
  • Computational mechanics / FEM modelling and simulation
  • Computer-based manufacturing technologies: CNC, CAD, CAM, FMS, CIM
  • Design and manufacture, medical device manufacturing
  • Friction and wear of materials, corrosion resistence
  • Functionality graded materials, cellular materials
  • Heat treatments, microstructure and materials properties
  • Hydrostatic transmissions and pneumatic
  • Instrumentation and measurement
  • Joining and fracture mechanics
  • Kinematics and dynamics of rigid bodies
  • Lubricants and lubrication
  • Machinability and formability of materials
  • Machining (traditional and non-traditional processes)
  • Manufacturing design for 3r “reduce, reuse, recycling”
  • Mechanisms and machines
  • Mechatronics and robotics
  • Metallic alloys and metal casting
  • Micro and nanomechanics
  • Multifunctional and smart materials
  • Nanomaterials and nanomanufacturing
  • Rapid manufacturing technologies and prototyping, remanufacturing
  • Recycling, materials and industrial wastes, products and recycling systems
  • Renewable energies technology
  • Solid mechanics and structural mechanics
  • Sustainable and green manufacturing
  • Thermodynamics and heat transfer
  • Tribology and surface engineering
  • Vibration and acoustics
  • Wood and wood products
Editorial Board

Editorial Board

Associate Editors
Dimitrios Manolakos, National Technical University of Athens, Greece
Han Huang, The University of Queensland, Australia
L. López de Lacallle, University of the Basque Country, Spain
Leonid Burstein, ORT Braude Engineering college (retired), Israel
Liangchi Zhang, University of New South Wales, Australia
Mark Jackson, Purdue University, United States
Patricio Franco, Technical University of Cartagena, Spain
Uday Dixit, Indian Institute of Technology Guwahati, India
Viktor Astakhov, Michigan State University, United States
Editorial Review Board
Aitzol Lamikiz, University of the Basque Country, Spain
Alfonso Ngan, University of Hong Kong, Hong Kong
Altino Loureiro, University of Coimbra, Portugal
Ana-Eva Jiménez-Ballesta, Technical University of Cartagena, Spain
Angelos Markopoulos, National Technical University of Athens, Greece ORCIDhttps://orcid.org/0000-0002-3754-5202
António Completo, University of Aveiro, Portugal
Bekir Yilbas, King Fahd University of Petroleum and Minerals, Saudi Arabia
Fabrizio Quadrini, University of Rome Tor Vergata, Italy
Filipe Teixeira-Dias, University of Aveiro, Portugal
Fusaomi Nagata, Tokyo University of Science, Yamaguchi, Japan
Inderdeep Singh, Indian Institute of Technology Roorke, India
Jack Zhou, Drexel University, United States
Jamal Ahmad, Khalifa University of Science and Technology, United Arab Emirates ORCIDhttps://orcid.org/0000-0003-3537-0311
Jing Shi, University of Cincinnati, United States
Jingwei Zhao, University of Wollongong, Australia
Jiwang Yan, Keio University, Japan
Jorge Ferreira, University of Aveiro, Portugal
José Cirne, University of Coimbra, Portugal
Juan Campos Rubio, Federal University of Minas Gerais, Brazil
KAPIL GUPTA, University of Johannesburg, South Africa
Kayaroganam Palanikumar, Sri Sairam Institute of Technology, India ORCIDhttps://orcid.org/0000-0003-1883-5105
Kevin Chou, University of Alabama, United States
Leonardo da Silva, Federal Center for Technological Education, Brazil
Lidia Gurau, Transilvania University of Brasov, Romania
Loredana Santo, University of Rome Tor Vergata, Italy
Maki Habib, The American University in Cairo, Egypt ORCIDhttps://orcid.org/0000-0001-8088-8043
Manish Roy, Defence Metallurgical Research Laboratory, India
Meng Ni, The Hong Kong Polytechnic University, China
Murali Sundaram, University of Cincinnati, United States
Nikolaos Vaxevanidis, School of Pedagogical & Technological Education (ASPETE), Greece
Nourredine Boubekry, University of North Texas, United States
Paulo Martins, University of Lisbon, Portugal
Prasanta Sahoo, Jadavpur University, India ORCIDhttps://orcid.org/0000-0002-1538-0646
R. Rao, Sardar Vallabhbhai National Institute of Technology (SV NIT), India
Ramon Quiza, University of Matanzas, Cuba
Robertt Valente, University of Aveiro, Portugal
Rui Moreira, University of Aveiro, Portugal
S. Basavarajappa, University B.D.T. College of Engineering, India
S. K. Shukla, Banaras Hindu University, India
S. R. Karnik, B.V. Bhoomaraddi College of Engineering and Technology, India
Sergiu-Dan Stan, Technical University of Cluj-Napoca, Romania
Shuting Lei, Kansas State University, United States
Teresa Duarte, University of Porto, Portugal
Vinayak Gaitonde, B.V. Bhoomaraddi College of Engineering and Technology, Hubballi, Karnataka, India, India ORCIDhttps://orcid.org/0000-0002-2572-8079
Vishal Sharma, Dr. B. R. Ambedkar National Institute of Technology, India
Xiaohong Zhang, Seagate Technology LLC, United States
Xipeng Xu, Huaqiao University, China
Yajie Lei, George Washington University, United States
Zhengyi Jiang, University of Wollongong, Australia
Latest Articles
Article Processing Charges
This journal operates under the Hybrid Open Access model, allowing the author to choose between traditional, subscription-based publishing, or Open Access publishing.
Subscription-Based Publishing/Green Open Access: Article manuscripts require no Article Processing Charge (APC) and require authors to transfer the copyright of the manuscript to IGI Global. Manuscripts are published behind a paywall and must be purchased for use. See the Fair Use Policy for sharing allowances conducive to Green Open Access.
Open Access Publishing: Article manuscripts receive the Creative Commons Attribution 4.0 International (CC BY 4.0) licensing arrangement. The copyright for the work remains solely with the author(s) of the article. Others may distribute, remix, tweak, and build upon the work, even commercially, without asking prior permission from the publisher or author and so long as they credit the author for the original creation. A one-time Article Processing Charge (APC) of US $2,000 must be paid AFTER the manuscript has gone through the full double-blind peer review process and the Editor(s)-in-Chief at his/her/their full discretion has decided to accept the manuscript based on the results of the double-blind peer review process. Learn more about APCs here.
Archiving
All of IGI Global’s content is archived via the CLOCKSS and LOCKSS initiative.
Contact

J. Paulo Davim, University of Aveiro, Portugal
Editor-in-Chief
International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME)
Email: pdavim@ua.pt