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International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME)
Emerging Sources Citation Index

International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME)

This journal will be converting from Hybrid Open Access to full Gold Open Access on January 1, 2022. All article manuscripts submitted September 1, 2021 onward will be processed through as open access submissions in preparation for the 2022 conversion.
Editor-in-Chief: J. Paulo Davim (University of Aveiro, Portugal)
Indexed In: Web of Science Emerging Sources Citation Index (ESCI), SCOPUS, INSPEC and 15 more indices
Published: Quarterly |Established: 2011
ISSN: 2156-1680|EISSN: 2156-1672|DOI: 10.4018/IJMMME
Journal Metrics
Submission to Acceptance: 60 Days (Approximately 09 Weeks)
Acceptance to Publication: 136 Days (Approximately 19 Weeks)
Acceptance Rate: 9%
Latest Published Articles
Published: Jan 1, 2021
DOI: 10.4018/IJMMME.2021010101
Volume 11
The objective of this study is to identify the impact of an inter-line conveyor on the throughput performance of manufacturing systems and determine the capacity of an inter-line conveyor to... Show More
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MLA

Dhurpate, Priyanka Raosaheb and Herman Tang. "Quantitative Analysis of the Impact of Inter-Line Conveyor Capacity for Throughput of Manufacturing Systems." vol.11, no.1 2021: pp.1-17. http://doi.org/10.4018/IJMMME.2021010101

APA

Dhurpate, P. R., & Tang, H. (2021). Quantitative Analysis of the Impact of Inter-Line Conveyor Capacity for Throughput of Manufacturing Systems. , 11(1), 1-17. http://doi.org/10.4018/IJMMME.2021010101

Chicago

Dhurpate, Priyanka Raosaheb, and Herman Tang. "Quantitative Analysis of the Impact of Inter-Line Conveyor Capacity for Throughput of Manufacturing Systems," 11, no.1: 1-17. http://doi.org/10.4018/IJMMME.2021010101

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Mendeley
Published: Jan 1, 2021
DOI: 10.4018/IJMMME.2021010102
Volume 11
This paper presents Taguchi's design of experiment approach to optimize the process parameters of a 3D printer for enhancing the compressive strength (CS) of porous bone scaffolds. Effect of four... Show More
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MLA

Sahu, Kiran Kumar and Yashwant Kumar Modi. "Effect of Printing Parameters on Compressive Strength of Additively Manufactured Porous Bone Scaffolds Using Taguchi Method." vol.11, no.1 2021: pp.18-33. http://doi.org/10.4018/IJMMME.2021010102

APA

Sahu, K. K., & Modi, Y. K. (2021). Effect of Printing Parameters on Compressive Strength of Additively Manufactured Porous Bone Scaffolds Using Taguchi Method. , 11(1), 18-33. http://doi.org/10.4018/IJMMME.2021010102

Chicago

Sahu, Kiran Kumar, and Yashwant Kumar Modi. "Effect of Printing Parameters on Compressive Strength of Additively Manufactured Porous Bone Scaffolds Using Taguchi Method," 11, no.1: 18-33. http://doi.org/10.4018/IJMMME.2021010102

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Mendeley
Published: Jan 1, 2021
DOI: 10.4018/IJMMME.2021010103
Volume 11
In the present work, damage produced by a crack in a statically loaded beam is first evaluated. Subsequently, an attempt is made to repair the effect of the crack by attaching a piezoelectric patch... Show More
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Cite Article

MLA

Roy, Goutam,et al. "Evaluation and Repair of Cracks on Statically Loaded Beams Using Piezoelectric Actuation." vol.11, no.1 2021: pp.34-49. http://doi.org/10.4018/IJMMME.2021010103

APA

Roy, G., Panigrahi, B. K., & Pohit, G. (2021). Evaluation and Repair of Cracks on Statically Loaded Beams Using Piezoelectric Actuation. , 11(1), 34-49. http://doi.org/10.4018/IJMMME.2021010103

Chicago

Roy, Goutam and Brajesh Kumar Panigrahi, and Goutam Pohit. "Evaluation and Repair of Cracks on Statically Loaded Beams Using Piezoelectric Actuation," 11, no.1: 34-49. http://doi.org/10.4018/IJMMME.2021010103

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Mendeley
Description, Mission, Scope & Coverage
Description:
The International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) is a refereed, interdisciplinary journal that publishes high quality articles with special emphasis on research and development in manufacturing, materials and mechanical engineering. IJMMME provides... Show More
Mission & Scope:
The mission of the International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) is to provide a channel of communication to disseminate knowledge between academics/researchers and industry practitioners. This journal can serve as a useful reference for academics, manufacturing, materials, mechanical, industrial, systems, environmental and physics engineers, materials... Show More
Coverage:
  • Aerodynamics and fluid mechanics
  • Artificial intelligence applied, optimization methods
  • Automation and control
  • Bioengineering materials, biomechanics and biotribology
  • Bulk deformation processes and sheet metal forming
  • Composites, ceramics, polymers / processing
  • Computational mechanics / FEM modelling and simulation
  • Computer-based manufacturing technologies: CNC, CAD, CAM, FMS, CIM
  • Design and manufacture, medical device manufacturing
  • Friction and wear of materials, corrosion resistence
  • Functionality graded materials, cellular materials
  • Heat treatments, microstructure and materials properties
  • Hydrostatic transmissions and pneumatic
  • Instrumentation and measurement
  • Joining and fracture mechanics
  • Kinematics and dynamics of rigid bodies
  • Lubricants and lubrication
  • Machinability and formability of materials
  • Machining (traditional and non-traditional processes)
  • Manufacturing design for 3r “reduce, reuse, recycling”
  • Mechanisms and machines
  • Mechatronics and robotics
  • Metallic alloys and metal casting
  • Micro and nanomechanics
  • Multifunctional and smart materials
  • Nanomaterials and nanomanufacturing
  • Rapid manufacturing technologies and prototyping, remanufacturing
  • Recycling, materials and industrial wastes, products and recycling systems
  • Renewable energies technology
  • Solid mechanics and structural mechanics
  • Sustainable and green manufacturing
  • Thermodynamics and heat transfer
  • Tribology and surface engineering
  • Vibration and acoustics
  • Wood and wood products
Editorial Board

Editorial Board

Associate Editors
Dimitrios Manolakos, National Technical University of Athens, Greece
Han Huang, The University of Queensland, Australia
L. López de Lacallle, University of the Basque Country, Spain
Leonid Burstein, ORT Braude Engineering college (retired), Israel
Liangchi Zhang, University of New South Wales, Australia
Mark Jackson, Purdue University, United States
Patricio Franco, Technical University of Cartagena, Spain
Uday Dixit, Indian Institute of Technology Guwahati, India
Viktor Astakhov, Michigan State University, United States
Editorial Review Board
Aitzol Lamikiz, University of the Basque Country, Spain
Alfonso Ngan, University of Hong Kong, Hong Kong
Altino Loureiro, University of Coimbra, Portugal
Ana-Eva Jiménez-Ballesta, Technical University of Cartagena, Spain
Angelos Markopoulos, National Technical University of Athens, Greece ORCIDhttps://orcid.org/0000-0002-3754-5202
António Completo, University of Aveiro, Portugal
Bekir Yilbas, King Fahd University of Petroleum and Minerals, Saudi Arabia
Fabrizio Quadrini, University of Rome Tor Vergata, Italy
Filipe Teixeira-Dias, University of Aveiro, Portugal
Fusaomi Nagata, Tokyo University of Science, Yamaguchi, Japan
Inderdeep Singh, Indian Institute of Technology Roorke, India
Jack Zhou, Drexel University, United States
Jamal Ahmad, Khalifa University of Science and Technology, United Arab Emirates ORCIDhttps://orcid.org/0000-0003-3537-0311
Jing Shi, University of Cincinnati, United States
Jingwei Zhao, University of Wollongong, Australia
Jiwang Yan, Keio University, Japan
Jorge Ferreira, University of Aveiro, Portugal
José Cirne, University of Coimbra, Portugal
Juan Campos Rubio, Federal University of Minas Gerais, Brazil
KAPIL GUPTA, University of Johannesburg, South Africa
Kayaroganam Palanikumar, Sri Sairam Institute of Technology, India ORCIDhttps://orcid.org/0000-0003-1883-5105
Kevin Chou, University of Alabama, United States
Leonardo da Silva, Federal Center for Technological Education, Brazil
Lidia Gurau, Transilvania University of Brasov, Romania
Loredana Santo, University of Rome Tor Vergata, Italy
Maki Habib, The American University in Cairo, Egypt ORCIDhttps://orcid.org/0000-0001-8088-8043
Manish Roy, Defence Metallurgical Research Laboratory, India
Meng Ni, The Hong Kong Polytechnic University, China
Murali Sundaram, University of Cincinnati, United States
Nikolaos Vaxevanidis, School of Pedagogical & Technological Education (ASPETE), Greece
Nourredine Boubekry, University of North Texas, United States
Paulo Martins, University of Lisbon, Portugal
Prasanta Sahoo, Jadavpur University, India ORCIDhttps://orcid.org/0000-0002-1538-0646
R. Rao, Sardar Vallabhbhai National Institute of Technology (SV NIT), India
Ramon Quiza, University of Matanzas, Cuba
Robertt Valente, University of Aveiro, Portugal
Rui Moreira, University of Aveiro, Portugal
S. Basavarajappa, University B.D.T. College of Engineering, India
S. K. Shukla, Banaras Hindu University, India
S. R. Karnik, B.V. Bhoomaraddi College of Engineering and Technology, India
Sergiu-Dan Stan, Technical University of Cluj-Napoca, Romania
Shuting Lei, Kansas State University, United States
Teresa Duarte, University of Porto, Portugal
Vinayak Gaitonde, B.V. Bhoomaraddi College of Engineering and Technology, Hubballi, Karnataka, India ORCIDhttps://orcid.org/0000-0002-2572-8079
Vishal Sharma, Dr. B. R. Ambedkar National Institute of Technology, India
Xiaohong Zhang, Seagate Technology LLC, United States
Xipeng Xu, Huaqiao University, China
Yajie Lei, George Washington University, United States
Zhengyi Jiang, University of Wollongong, Australia
IGI Global Open Access
As an academic publisher at the forefront of advancement for over 30 years, IGI Global OA provides quality, expediate OA publishing with a top-of-the-line production system backed by the international Committee on Publication Ethics (COPE). With a streamlined publishing process, flexible funding options, and more. Researchers can freely and immediately share their peer-reviewed research with the world.
  • Rigorous and Expediate Publishing Process Taking as Little as 30 Days
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Article Processing Charges
Article Processing Charge (APC):

Payment of the APC fee (directly to the publisher) by the author or a funding body is not required until AFTER the manuscript has gone through the full double-blind peer review process and the Editor(s)-in-Chief at his/her/their full discretion has/have decided to accept the manuscript based on the results of the double-blind peer review process. 
Please note that IGI Global cannot schedule the article for publication or publish the article until payment has been received. It is also important to note that in scholarly publishing, utilizing an open access journal’s resources and time with no intent to pay the open access Article Processing Charge (APC) if the article manuscript is accepted following the peer review process is considered to be unethical and exploitative.

What Does IGI Global’s Open Access APC Cover?

In the traditional subscription-based model, the cost to the publisher to produce each article is covered by the revenue generated by journal subscriptions. Under OA, all the articles are published under a Creative Commons (CC BY) license; therefore, the authors or funding body will pay a one-time article processing charge (APC) to offset the costs of all of the activities associated with the publication of the article manuscript, including:

  • Digital tools used to support the manuscript management and review process
  • Typesetting, formatting and layout
  • Online hosting
  • Submission of the journal’s content to numerous abstracts, directories, and indexes
  • Third-party software (e.g. plagiarism checks)
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    the authors
APC Subsidizing and Waivers

To assist researchers in covering the costs of the APC in OA publishing, there are various sources of OA funding. Additionally, unlike many other publishers, IGI Global offers flexible subsidies, 100% Open Access APC waivers, discounts, and more. Learn More

Submit to This Journal
This journal is currently actively seeking new submissions. Interested authors should ensure that their article manuscript adheres to the journal’s submission guidelines and utilize the journal article template, which include originality of the manuscript, professional English language copy editing, APA formatting tips, and more. To submit an article for consideration, please begin the submission process below.
Contact

J. Paulo Davim, University of Aveiro, Portugal
Editor-in-Chief
International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME)
Email: pdavim@ua.pt
Archiving
All of IGI Global’s content is archived via the CLOCKSS and LOCKSS initiative. Additionally, all IGI Global published content is available in IGI Global’s InfoSci® platform.