Call for Chapters: Artificial Intelligence Applications and Simulation Tools for High Temperature Materials


Christo Ananth, Samarkand State University,Uzbekistan, Missing Country
Akm Rahman, City University of New York, United States
S. Prabhakar, Wollo University-Kiot, Ethiopia

Call for Chapters

Proposals Submission Deadline: September 28, 2022
Full Chapters Due: December 11, 2022
Submission Date: December 11, 2022


Using High Temperature Processes is a key tool in real-time manufacturing world to manufacture Metal Products which are very hard for analysis, modeling and control. The Development of Artificial Intelligence aided Computer Modeling and Simulation Tools is the key tool for movement of Materials in Corrosive Environments. Advanced Control Algorithms developed from Artificial Intelligence-led Computer Systems combines computer simulations and Topology-Driven Optimization Methods and marches forward to the next phase of Furnace Design. Developed Artificial-intelligence methods based on deep neural networks utilize high-fidelity simulation results to Perform Real-Time Critical Solutions.


Artificial Intelligence Applications and Simulation Tools for High Temperature Materials provides Future Projections of Artificial Intelligence techniques in High Temperature Materials, Training the Machine Learning Tools, Graphical user interface for Fast-running AI model of Glass-melt furnace operations, Setting the Furnace Temperatures based on Complex Computation Fluid Dynamics Models and Examples from Float-Glass, Metal Casting Industries. The book will open doors for AI Experts to use High Temperature Materials as an Effective tool in Real-world Problems in High Performance Computing for Energy Innovation and High Performance Computing for Materials. This Book will be a Key Reference for Students, Practitioners, Professionals, Scientists and Engineer – Researchers to improve industry competitiveness and to combat the shortcomings of energy consumption.

Target Audience

The target audience will be Students, Practitioners, Professionals, Scientists, Industrialists and Engineer – Researchers of various sectors.

Recommended Topics

1. AI-fed Precision Adaptive Machining for High Temperature Materials 2. Artificial Intelligence Based Super Alloys for Aerospace Industries 3. Artificial Intelligence based Thermodynamic Studies of High Temperature Materials 4. Artificial Intelligence Discovery of High Temperature Polymers 5. Artificial Intelligence Driven High-temperature materials for structural applications 6. Artificial Intelligence Tools for Accelerated Design of High Temperature Alloys 7. Bulk Metallic Glasses, Nanomaterials and its AI Behavior 8. Elevated Temperature Artificial Intelligence Alloys for Aircrafts 9. Evaluation of Concrete Structures in Dense Environments based on Artificial Intelligence Framework 10. High Temperature Materials and its Artificial Intelligence for Gas Turbines 11. Intermetallic based High Temperature Materials and its Artificial Intelligence 12. Material Science in AI Age 13. Mechanics of Refractoriness’ and Artificial Intelligence based Structural Strength of Materials 14. Monitoring, Modeling and Controlling High-Temperature Manufacturing Processes with AI 15. Prediction of High Temperature Flow Stress of Metals based on Artificial Intelligence 16. Reduction Temperature of metal oxides to their base metals through Quantum Mechanics and Artificial Intelligence 17. Self-Propagating High Temperature Synthesis of High Temperature Materials and its Artificial Intelligence 18. Semiconductor Material Analysis in Industries and its AI Processes 19. Temperature Modelling in the Metal Cutting Process through Artificial Intelligence Techniques 20. Ultrahigh Temperature Materials and its Artificial Intelligence for Jet Engines

Submission Procedure

Researchers and practitioners are invited to submit on or before September 28, 2022, a chapter proposal of 1,000 to 2,000 words clearly explaining the mission and concerns of his or her proposed chapter. Authors will be notified by October 12, 2022 about the status of their proposals and sent chapter guidelines.Full chapters are expected to be submitted by December 11, 2022, and all interested authors must consult the guidelines for manuscript submissions at prior to submission. All submitted chapters will be reviewed on a double-blind review basis. Contributors may also be requested to serve as reviewers for this project.

Note: There are no submission or acceptance fees for manuscripts submitted to this book publication, Artificial Intelligence Applications and Simulation Tools for High Temperature Materials. All manuscripts are accepted based on a double-blind peer review editorial process.

All proposals should be submitted through the eEditorial Discovery® online submission manager.


This book is scheduled to be published by IGI Global (formerly Idea Group Inc.), an international academic publisher of the "Information Science Reference" (formerly Idea Group Reference), "Medical Information Science Reference," "Business Science Reference," and "Engineering Science Reference" imprints. IGI Global specializes in publishing reference books, scholarly journals, and electronic databases featuring academic research on a variety of innovative topic areas including, but not limited to, education, social science, medicine and healthcare, business and management, information science and technology, engineering, public administration, library and information science, media and communication studies, and environmental science. For additional information regarding the publisher, please visit This publication is anticipated to be released in 2023.

Important Dates

September 28, 2022: Proposal Submission Deadline
October 12, 2022: Notification of Acceptance
December 11, 2022: Full Chapter Submission
January 24, 2023: Review Results Returned
March 7, 2023: Final Acceptance Notification
March 21, 2023: Final Chapter Submission


Christo Ananth
Samarkand State University,Uzbekistan

Akm Rahman
City University of New York

S. Prabhakar
Wollo University-Kiot


Computer Science and Information Technology; Education; Science and Engineering
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